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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 58 (1985), S. 987-989 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A new technique for the formation of ultrathin tungsten filaments is described. It is based on the selective deposition of tungsten via the silicon reduction of WF6 along the sidewall of a photolithographically defined undoped polycrystalline silicon/SiO2 step. The width of the filament is determined by the tungsten deposition parameters and the thickness by the thickness of the polycrystalline film. Filaments with a cross section of 600×2000 A(ring) and 67.5, 140, and 265 μm lengths have been fabricated by this method. Initial low temperature resistance measurements of nonimplanted and Si-implanted (1×1015 cm−2, 20 keV) filaments show localization/electron-electron interaction behavior.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Millimeter-wave rf cavities for use in linear accelerators, free-electron lasers, and mm-wave undulators are under development at Argonne National Laboratory. Typical cavity dimensions are in the 1000 μm range, and the overall length of the accelerator structure, which consists of 30–100 cavities, is about 50–100 mm. An accuracy of 0.2% in the cavity dimensions is necessary in order to achieve a high Q-factor of the cavity. To achieve this, these structures are being fabricated using deep X-ray lithography, electroforming, and assembly (LIGA). The first prototype cavity structures are designed for 108 GHz and 2π/3-mode operation. Input and output couplers are integrated with the cavity structures. The cavities are fabricated on copper substrates by electroforming copper into 1 mm-thick PMMA resists patterned by deep x-ray lithography and polishing the copper down to the desired thickness. These are fabricated separately and subsequently assembled with precision spacing and alignment using microspheres, optical fibers, or microfabricated spacers/alignment pieces. Details of the fabrication process, alignment, and assembly work are presented in here.
    Type of Medium: Electronic Resource
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