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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 5093-5099 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The microstructure was measured for AlCu lines, formed using either a traditional planar metal subtractive etch process or a newly developed hot AlCu-trench-damascene process. It was found that 0.35 μm wide damascene AlCu lines formed a large grained bamboo microstructure with little or no Al (111) texture. The local crystallographic texture was measured in a scanning electron microscope using electron backscatter pattern analysis often referred to as backscatter Kikuchi diffraction. Damascene structures consisted of AlCu films deposited at greater than 400 °C onto Ti or Ti/TiN into preformed amorphous SiO2 trenches, 0.3–5.0 μm wide by 0.4 μm deep, followed by aluminum chemical mechanical polishing to remove the metal overburden. Standard planar metal control samples consisted of blanket Al or AlCu films deposited onto either an amorphous SiO2 substrate or onto SiO2/Ti/TiN substrates, followed by subtractive etching to define 0.45–10 μm wide lines as well as large (e.g., 10×10 μm2) pads. The planar metal samples exhibited either little change or a slight strengthening of their (111) fiber texture with decreasing line width; this was in sharp contrast to the damascene films in which a marked weakening in the (111) fiber texture with decreasing line width was found. In addition a trimodal (111) texture distribution developed in trenches where TiAl3 intermetallic formed. The role of intermetallic formation (TiAl3), elevated (〉400 °C) AlCu deposition temperature, large bamboo grain size, local AlCu crystallographic texture and differences in sidewall coverage between subtractive etched and trench-damascene processed AlCu on film microstructure are examined. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 24 (1989), S. 1169-1176 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Thin films of aluminium oxide were deposited on ferrite (Ni x Zn1−x Fe2O4) substrates by r.f. sputtering. The sputtered alumina films were not easily etched by hot phosphoric acid unlike readily etchable films prepared by physical deposition techniques. Microanalytical characterization of unetched films, partially etched films and interfacial regions was conducted to identify the microscopic features responsible for reluctant film etchability. The post-etched films were categorized as easily, partially and un-etchable (EE, PE and U respectively) and were examined using optical microscopy, SEM, XRD, EDS, XPS, AES, and TEM/STEM. TEM examination of cross-sections of partially etchable films revealed a non-uniform crystalline phase at the film-substrate interface. Electron diffraction data identified the phase asη-alumina although AES and EDS results suggest that the interfacial phase also contained some iron. The occurrence and orientation of theη-alumina phase was shown to depend on the orientation of the grains of the ferrite substrate.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 3
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 24 (1989), S. 1169-1176 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Thin films of aluminium oxide were deposited on ferrite (Ni x Zn1−x Fe2O4) substrates by r.f. sputtering. The sputtered alumina films were not easily etched by hot phosphoric acid unlike readily etchable films prepared by physical deposition techniques. Microanalytical characterization of unetched films, partially etched films and interfacial regions was conducted to identify the microscopic features responsible for reluctant film etchability. The post-etched films were categorized as easily, partially and un-etchable (EE, PE and U respectively) and were examined using optical microscopy, SEM, XRD, EDS, XPS, AES, and TEM/STEM. TEM examination of cross-sections of partially etchable films revealed a non-uniform crystalline phase at the film-substrate interface. Electron diffraction data identified the phase asη-alumina although AES and EDS results suggest that the interfacial phase also contained some iron. The occurrence and orientation of theη-alumina phase was shown to depend on the orientation of the grains of the ferrite substrate.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
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