Library

X
feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
  • 1
    Electronic Resource
    Electronic Resource
    A Study on Computer Simulation of Plastic Lens Molding Process (2004)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 471-472 (Dec. 2004), p. 490-493 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In this paper, some molding process parameters such as injection time, packing time,packing pressure and process temperature etc. were optimized by the Computer Aided Engineering (CAE) simulation (Moldex 3D) for injection molding of a plastic lens. Some experimental trials were carried out for verifying of the CAE simulation results with checking of the lens shrinkage and birefringence etc. as well. The results showed that, the recommended molding process parameters from CAE simulation and the actual experiments were almost the same, hence the CAE is aestablished tool based on the scientific approach to reduce experimental works, to identify critical parameters and to save substantial costs. Lately, a perfect plastic lens was gained by the Injection–Compression Molding process with the optimized process parameters by a CAE simulation
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/09/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.471-472.490.pdf
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 2
    Electronic Resource
    Electronic Resource
    A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 472-475 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Double sided polishing process has become a main machining method for silicon waferfinishing process, but it is difficult to get ultra-smooth surface with the very stringent machiningconditions. In this paper, the mechanism of ultra-smooth surface machining process was studied, themain parameters affecting the surface quality of silicon wafer, such as the polishing pad and carrierrotation speed, polishing press, polishing slurries etc. , were discussed and optimized, thenultra-smooth surface of silicon wafer with Ra 0.4nm has been obtained based on the above study. Anew double sided polishing machine with computer control system equipped with a digitalcontrolled press valve was developed, and the ultra-smooth machining process of silicon wafer wasestablished in this paper
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.472.pdf
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 3
    Electronic Resource
    Electronic Resource
    Application of the Electrical Discharge Truing Technique on the Lapping Machining Process (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 304-305 (Feb. 2006), p. 94-98 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: This paper discussed the principle about the Electrical Discharge Truing(EDT)technique ,which applied in lapping machining process, including EDT status with different environment and machining conditions, and an EDT equipment on a lapping machine have been developed and used in the experiment of EDT. Then some experiments were carried out for verifying of the EDT effect with different EDT parameters such as electric voltage, EDT gap, and the EDT media. Finally, the efficient and precision EDT was achieved with the suitable EDTparameters
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/50/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.304-305.94.pdf
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 4
    Electronic Resource
    Electronic Resource
    A Study on the Grinding Temperature Field for Titanium Alloy (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 339 (May 2007), p. 45-49 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A reasonable finite element (FE) model of grinding temperature field has been developedon the basis of analysis of the transient temperature field， and three kinds of boundary conditionsare loaded on the element of a moving heat source. The study, which is based on the finite elementprinciple, has been carried out using the numerical simulation software ANSYS. Many results havebeen obtained including three dimensional temperature distribution map. The simulated resultsunder different conditions show good agreement with the experimental results. With the comparisonof the dry-grinding and wet-grinding, the result shows that the wet-grinding temperature with aproper grinding fluid is rather lower than the dry-grinding temperature. Finally, the variablecoefficient of convective heat transfer and the different form heat source have been discussed indetail
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/53/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.339.45.pdf
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 5
    Electronic Resource
    Electronic Resource
    The Development of the Precise Double Sided Polishing Machine (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 315-316 (July 2006), p. 375-379 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The functional materials such as sapphire, silicon wafer etc. are processed efficientlywith ultra-smooth surface for the demand of the rapid development of the IC industry. The precisedouble sided polishing process is one of the main methods of getting the ultra-smooth surface forthese materials. This paper introduces the structure and characteristic of the precise double sidedpolishing machine with a precise pressure control system equipped a new type electro-pneumaticdigital servo valve. The works, such as machine design, development of the control system andoptimization of process parameters etc. are carried out to meet the requirement of the precise doublesided polishing machining process. This equipment has the characteristic of high machiningprecision and precise control capability, so it can be applied to the ultra-precise machining of theultra-thin sapphire, silicon wafers etc
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.315-316.375.pdf
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...