ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
New challenges for design, manufacturing and packaging of MEMS/NEMS arise fromthe ongoing miniaturization process. Therefore there is a demand on detailed information onthermo-mechanical material properties of the applied materials. Because of size effects and thestrong dependency of the thermo-mechanical behavior of active and passive components on processparameters often unsolved questions of residual stresses lead to system failure due to crackformation. With the fibDAC (Focused Ion Beam based Deformation Analysis by Correlation)method which is presented in this paper the classical hole drilling method for stress releasemeasurement has been downscaled to the nanoscale. The ion beam of the FIB station is used as amilling tool which causes the stress release at silicon microstructures of MEMS devices. Theanalysis of the stress release is achieved by digital image correlation (DIC) applied to load stateSEM images captured in a cross beam equipment (combination of SEM and FIB). The results of theDIC analysis are deformation fields which are transferred to stress solution by application of finiteelement analysis. In another step the resolution of the method has been improved by the applicationof trench milling instead of hole milling. Thereby deformation measurements in the nm range areestablished. The method is also a powerful tool for the analysis of sub-grain stresses of engineeringmaterials
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/13/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.524-525.121.pdf
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