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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 569 (Jan. 2008), p. 129-132 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Lithium niobate (LN, LiNbO3) is a kind of artificial crystal with piezoelectricity,pyroelectricity and ferroelectricity, which has been widely used in electron components. The largedifference in thermal expansion coefficients between Si and LN causes a serious thermal stress duringthe thermal-pressure bonding process. Therefore room temperature bonding would be the bestcandidate to make strong and stress-free interface between Si and LN. However, room temperaturebonding requires lower surface roughness (Ra〈2nm) and lower defects on the LN wafer surface thanthose of thermal bonding. Chemical mechanical polishing (CMP) process helps LN to obtain the highquality surface and thin wafer suited in room temperature bonding. The LN wafer was polished usingcolloidal silica slurry, resulting in high material removal rate (MRR) and fine surface quality underthe condition of low pH, high abrasive concentration and low flow rate. The polishing mechanism ofLN was discussed by mechanical, chemical and thermal analysis
    Type of Medium: Electronic Resource
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