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  • 1
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    Macromolecules 26 (1993), S. 2390-2391 
    ISSN: 1520-5835
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Physics
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    Macromolecules 22 (1989), S. 1189-1195 
    ISSN: 1520-5835
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Physics
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Springer
    Polymer bulletin 2 (1980), S. 263-267 
    ISSN: 1436-2449
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Summary A high degree of hydrogenation of a polypentenamer was achieved with a homogeneous catalyst based on a metal alkyl-transition metal complex . Essentially complete saturation of the polymer was achieved without significant changes in molecular weight or molecular weight distribution.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 1553-1559 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The cure of an epoxy-anhydride resin system used in pultrusion was characterized to develop an understanding of the cure behavior and to determine potential process controls parameters. Isothermal cures of neat resin formulations were monitored by differential scanning calorimetry (DSC), torsional braid analysis (TBA), and microdielectrometry (MDE). The processing conditions define a time/ temperature region in which monitoring would be applicable. Both DSC and MDE were found to yield useful information in this region, however, the events typically monitored by TBA either did not occur or occurred too quickly to be monitored. Significant ionic conductivity was observed in the fully cured resins at temperatures above the glass transition temperature and could possibly be used as a control parameter. This study revealed an apparent change in reaction mechanism with increasing cure temperature. DSC showed a change in activation energy with extent of reaction and a decrease in heat of reaction at the higher isothermal cure temperatures. The formation of a different network structure was indicated by a decreasing glass transition temperature of the cured resin with increasing cure temperature by both DSC and TBA.
    Additional Material: 12 Ill.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 53 (1994), S. 429-440 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The cure behavior of diglycidyl ether of bisphenol A (DGEBA) type of epoxy resins with three aromatic diamines, 4,4′-diaminodiphenyl methane (DDM), 4,4′-diaminodiphenyl sulfone (44DDS), and 3,3′-diaminodiphenyl sulfone (33DDS) was studied by torsional braid analysis. For each curing agent the stoichiometry of the resin mixtures was varied from a two to one excess of amino hydrogens per epoxy group to a two to one excess of epoxy groups per amino hydrogen. Isothermal cures of the resin mixtures were carried out from 70 to 210°C (range depending on epoxy - amine mixture), followed by a temperature scan to determine the glass transition temperature (Tg). The times to the isothermal liquid-to-rubber transition were shortest for the DDM mixtures and longest for the 44DDS mixtures. The liquid-to-rubber transition times were also shortest for the amine excess mixtures when stoichiometry was varied. A relatively rapid reaction to the liquid-to-rubber transition was observed for the epoxy excess mixtures, followed by an exceedingly slow reaction process at cure temperatures well above the Tg. This slow process was only observed for epoxy excess mixtures and eventually led to significant increases in Tg. Using time - temperature shifts of the glass transition temperature vs. logarithm of time, activation energies approximately 50% higher were derived for this process compared to those derived from the liquid-to-rubber transition. The rate of this reaction was virtually independent of curing agent and was attributed to etherification taking place in the epoxy excess mixtures. © 1994 John Wiley & Sons, Inc.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 17 (1991), S. 530-532 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Brookfield, Conn. : Wiley-Blackwell
    Polymer Composites 8 (1987), S. 232-236 
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The feasibility of using a microdielectric sensor to characterize the cure behavior of a commercial prepreg roving was investigated. Chemical and physical characterization methods were first used to determine the uniformity of the prepreg material. Thermal, dynamic mechanical, and dielectric methods were then utilized to monitor the cure cycle. The dielectric response was found to be independent of the glass fibers of the prepreg and to show reproducible changes in the early part of cure over a temperature range of 80 to 135°C. The manufacturer's recommended cure temperature of 121°C (250°F) was found to correspond to the onset of the ultimate glass transition of the material. Variations in the dielectric response in the latter part of cure at this temperature and above were attributed in part to this event.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
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