ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging asintegral part in facilitating the growth of wafer level packaging and stacked die packaging. DAFapplied to the backside of wafers prior to saw have many advantages, such as the elimination of theepoxy dispensed process step and the reduction of epoxy related failure mode. However, the dicingprocess for DAF wafer usually associated with sidewall chipping, DAF whiskering and crack thatwill affect reliability of Quad Flat Non-Leaded (QFN) stacked die. Blade properties andcharacteristics are the crucial factor in analyzing the DAF dicing results. In this paper, we evaluatethe blade characteristics before and after DAF wafer dicing process for our stacked die packaging.The qualitative measure by means of the Scanning Electron Microscope (SEM) and EnergyDispersive X-Ray (EDX) analysis were performed in order to understand the lamination and dullingeffect on blade surface. The obtained results showed that sawing polymeric material such as waferlaminated with DAF induces lamination of polymeric material onto the blade surface and reduceblade cutting edge. As a result, reduce the quality of DAF dicing process
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.31.202.pdf
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