ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract Bonding between copper and alumina can be obtained by the “solid state bonding” process and the “liquid phase bonding” process. The strength of interfaces has been tested mechanically using shear tests, tensile tests and fracture toughness tests. The effects of bonding parameters on bond strength have been studied. Observations by transmisssion electron microscopy have been performed to detect and analyse the nature and evolution of interfacial compounds as a function of copper oxidation and bonding time. Chemical reactions lead to the formation of the binary oxide CuAlO2. The stability of this compound and the reversibility of chemical reactions appear to be very dependent on the amount of oxygen present in the system.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00544543
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