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  • 1
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Porous silicon (PS) layers were formed by anodization on polished substrates of (1 0 0)Si at different current densities for a fixed anodization time of 30 mins. using different screenprinted/evaporated back contacts (Ag, Al) respectively. The PS films has been characterized byhigh resolution X-ray diffraction (HRXRD), photoluminescence (PL), Scanning ElectronMicroscopy (SEM) and Fourier Transform Infrared (FTIR) techniques respectively. Porosity andthickness of PS layers were estimated by gravimetric analysis. The properties of PS formed usingscreen-printed Ag & Al as the back contacts (SP-(Ag/Al)) was found to be superior as compared tothe corresponding films with evaporated back contacts (EV-(Ag/Al)). The PS formed with screenprintedAg & Al-back contacts shows better crystalline perfection, higher stability, higher PLefficiency and negligible PL decay compared to that formed with evaporated Ag & Al- as the backcontact for the same current density and time of anodization
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 47-48 (July 1995), p. 377-382 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 8092-8095 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: High-resolution diffuse x-ray scattering (DXS) measurements made with a multicrystal x-ray diffractometer have been used to characterize point defect clusters produced by 90-keV and 135-keV BF+2 implantations (fluence=1×1015 cm−2). The specimens were 50-mm-diam (100) silicon single crystals (n type; 4–6 Ω cm resistivity). A highly monochromated and collimated Kα1 is obtained by three-plane (111) silicon single crystals oriented in (+,−,−) setting. The DXS intensity around 400 reciprocal lattice point was measured along [〈sx〉100〈be〉±] directions. Implantation produced a slight broadening of diffraction curves from ∼6 to ∼7 arcsec. From unimplanted regions diffuse scattering was primarily due to isolated interstitial point defects in the investigated volume of reciprocal space. Implantation was found to produce interstitial point defect clusters. Experimental data has been analyzed by using a phenomenological model for dislocation loops by using a curve fitting method. The values of loop size Rcl, volume of the loops Acl, and number of defects per loop Ncl have been determined. For implantation energies of 90 and 135 keV, these are, respectively, Rcl=1.47×10−4 and 1.29×10−4 cm, Acl=2.92×10−16 and 2.27×10−16 cm3, and Ncl=1.46×107 and 1.37×107.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 82 (1997), S. 1172-1177 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Heterostructure Si1−xGex layers on (001)Si substrates with different degrees of relaxation R, ranging from the nearly pseudomorphic state to the nearly relaxed state (R∼0.8), were characterized by diffuse x-ray scattering measurements. The lattice constants a⊥ and a(parallel), and from these the Ge content x, the relaxation R, and misfit dislocation density Dd, were determined by single crystal diffractometry. The thickness of the SiGe layers was measured in the as-grown state by double crystal diffractometry. A standard triple crystal x-ray diffractometer was used to analyze the diffuse x-ray scattering (DXS) intensity by rotation of the analyzer crystal (Δaitch-theta) at a fixed sample position (α). The intensities were measured around the 004 reciprocal lattice point of the Si substrate using a wide open counter and a wide range of rotation angle (Δaitch-theta) for the analyzer crystal. The diffuse scattering increases steeply with increasing dislocation density up to a critical value of Dd(approximate)5×104 cm−1. Then it reaches saturation and decreases slowly as Dd increases. This behavior can be explained by the superposition of the strain fields of neighboring dislocations above a critical density, so that only the heavily distorted regions near the dislocation core participate in scattering. This is confirmed by the fact that the DXS measured for different α values follows the Stokes–Wilson scattering ( IDXS∝q−4; q being the scattering vector). We show that the diffuse scattering technique is a very sensitive tool to detect relaxation at relatively low levels of dislocation densities Dd less than 5×104 cm−1, where diffractometric techniques that measure the lattice constants are near their resolution limits. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Copenhagen : International Union of Crystallography (IUCr)
    Applied crystallography online 33 (2000), S. 2-9 
    ISSN: 1600-5767
    Source: Crystallography Journals Online : IUCR Backfile Archive 1948-2001
    Topics: Geosciences , Physics
    Notes: High-resolution X-ray diffractometry, absolute integrated intensity (ρ) measurements, diffuse X-ray scattering (DXS) and infrared (IR) absorption techniques were used to investigate the influence of oxygen on the structural perfection of high purity (resistivity of the order of 4 kΩ cm) float zone (FZ) grown (111) silicon single crystals. A multicrystal diffractometer set in (+,-,-,+) geometry, with Mo Kα1 radiation, was employed. From the infrared measurements, the oxygen concentration in the sample was determined to be 1.3 × 1017 atoms cm^{-3}. High-resolution X-ray diffraction curves of the as-grown crystal had half-widths of ∼11 arcsec; the ρ value was 3.5 × 10^{-5} rad. To incorporate oxygen in a controlled manner into the specimens, they were annealed under dry oxygen ambient for 8 h in the temperature range 573–1373 K (in eight steps). Up to 723 K there was no appreciable change in oxygen content or in the degree of perfection. Annealing at temperatures (AT) 〉 873 K resulted in considerable increases in the oxygen content, as well as significant improvements in the degree of perfection. For example, as the level of oxygen increased from 1.3 × 1017 to 3.6 × 1017 atoms cm^{-3} for A_T=873 K, the values of half-widths and ρ decreased to ∼7 arcsec and 2.4 × 10^{-5} rad, respectively. However, annealing above 1273 K produced deterioration in lattice perfection. DXS measurements showed remarkable changes in the nature of point defects and their clusters with change in AT. Up to A_T=973 K, the defects were predominantly vacancy clusters. However, with AT in the range 1073–1273 K, the predominent defects were isolated interstitials. Further increase in AT led to interstitial cluster formation, which deteriorated the lattice perfection. This study clearly demonstrates that oxygen concentration in the range ∼3 × 1017 to 13 × 1017 atoms cm^{-3} leads to significant improvement in structural perfection of silicon single crystals.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Copenhagen : International Union of Crystallography (IUCr)
    Applied crystallography online 22 (1989), S. 209-215 
    ISSN: 1600-5767
    Source: Crystallography Journals Online : IUCR Backfile Archive 1948-2001
    Topics: Geosciences , Physics
    Notes: Point-defect aggregates in (111) dislocation-free silicon single crystals grown by the float-zone (FZ) method have been studied by diffuse X-ray scattering (DXS) and compared with those in the Czochralski-grown (CZ) crystals. A two-axis X-ray diffractometer was used. It employs three monochromators in (+, −, −) setting to obtain a highly collimated and monochromatic Mo Kα1 beam. DXS measurements were made around the 111 reciprocal-lattice point (r.l.p.) with K* along ±[111] and ±[01{\bar 1}]; K is the vector which joins the elemental volume of the reciprocal space under investigation to the nearest r.l.p. For FZ crystals for a given K* the DXS intensity was higher for θ 〈 θB in comparison with that for θ 〉 θB showing that the anisotropy (DXS Iθ 〉 θB − DXS Iθ 〈 θB) is negative, as expected for vacancy clusters. For CZ crystals the anisotropy was positive, owing to the presence of interstitial clusters. The magnitude of anisotropy in the FZ crystals was smaller than that observed in the CZ crystals. The DXS intensity varies approximately as K−2 near Bragg peaks (Huang scattering) and as K*−4 (Stokes–Wilson scattering) away from it. From the K* values where the changeover from Huang to Stokes–Wilson scattering takes place the size of the clusters assumed to be the origin of the observed DXS is estimated as ̃2 × 10−4 and 2.6 × 10−3 mm for FZ and ̃5.5 × 10−4 and 3 × 10−3 mm for CZ crystals. The experimental data were compared with theoretically calculated DXS distributions assuming the defects to be dislocation loops. The number of point defects in a loop has been estimated.
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