ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
In general, Electrostatic chuck (ESC) was used to fix and clamp the silicon wafer withelectrostatic force in the semiconductor fabrication process. Recently, due to their excellent chemicaland plasma stability and high thermal conductivity, sintered ceramics has been used as an insulatormaterial in the configuration of ESC. However, metals of high melting point, such as Mo, W, stillused for electrode materials. Because of the thermal mismatch between metal electrode and ceramicinsulator, micro cracks were produced at the interface during sintering process of ceramic or itsoperation process with high temperature, which leads to reduce the life time of ESC. To improve thecompatibility between metal and ceramic, mesh type metal electrode was used in ESC but this type ofelectrode results in inhomogeneous electrostatic force. Homogeneous clamping force is veryimportant to determine the final quality of semiconductor. We have investigated a ceramicelectrostatic chuck composed of conducting ceramic electrode of titanium nitride instead of metalelectrode. Aluminum nitride was added to titanium nitride to control the thermal expansioncoefficient. This composite electrode shows not only a good electrical conductivity but also anexcellent compatibility to dielectric layer. Compatibility between the electrode and dielectric layerenable to design the electrode with continuous sheet type which leads to homogeneous electrostaticforce. Electrostatic force of ceramic ESC with conducting ceramic electrode was about 1700gf/4inchwafer when the applied voltage was DC 3kV
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.124-126.791.pdf
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