ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
NiTi shape memory alloy particles have been incorporated inside SnAgCu lead freesolder paste in order to improve the mechanical performances of solder paste. However, because ofthe non-wetting properties of solid NiTi particles by the liquid SnAgCu matrix, the development offluorine gas treatment of both NiTi and SnAgCu particles has been optimized. Scanning electronmicroscopy (SEM) micrographs of NiTi/SnAgCu composite materials have shown that “Fluorinetreatment” of SnAgCu powders lead to a huge increase of the NiTi powder content inside theliquid SnAgCu matrix where no effect have been observed when NiTi materials are fluorinated. Xrayphotoelectron spectroscopy analysis of treated SnAgCu powders have been used in order toanalyze surface chemistry evolution where wavelength dispersion spectroscopy line profiles, acrossNiTi-SnAgCu interfaces, have been performed
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.534-536.1461.pdf
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