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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 131-133 (Oct. 2007), p. 497-502 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: We have carried out DLTS in highly doped p+n Ultra Shallow Junctions (USJ) in Siformed by ion implantation. The samples were implanted either with a 10keV or a 5keV B implantat a dose of 5*1015cm15. The 10keV sample was also implanted with P and the 5keV samples wereimplanted with P and increasing doses of As to simulate an USJ in an n-well. Due to the high Pand/or As implant doses, it was observed that a band offset also exists between the n-type implantedregion and the n-type starting material. Therefore these samples contain another depletion regionapart from the expected p+n depletion region. However, the electric fields in these regions act inopposite directions assisting the profiling of different regions after careful selection of biasingconditions. A deep state is observed in the n-type region at EC-0.34eV which has a complex LaplaceDLTS signature, which has arisen due to the implantation process
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In this paper, we investigate the evolution of extended defects during a millisecondFlash anneal after a preamorphising implant. The experimental results, supported by predictivesimulations, indicate that during the ultra-fast temperature ramp-up and rump-down occurring in amillisecond Flash anneal, the basic mechanisms that control the growth and evolution of extendeddefects are not modified with respect to the relatively slower annealing processes, such as “soak”and “spike” Rapid Thermal Annealing. In addition, we have observed a decrease in the number oftrapped interstitials in the End-Of-Range (EOR) defects when decreasing the Ge+ amorphisationenergy from 30 keV down to 2 keV. This result is ascribed to two concomitant phenomena: (i) theincrease of the initial number of interstitials, Ni, created by the amorphisation step, when theimplant energy is decreased and (ii) the efficient interstitial annihilation at the silicon surface, whoserecombination length, Lsurf, is in the nanometer range even at the very high temperatures employedin millisecond Flash anneals
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 573-574 (Mar. 2008), p. 333-338 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In this paper the formation strategies for source and drain regions in vertical FinFETs arediscussed. The technology challenges are very different than for planar bulk devices. Here the maindoping approaches are presented with their advantages and drawbacks. Source/drain formation byion implantation, and deposition techniques are discussed with respect to process simplicity, anddevice requirements
    Type of Medium: Electronic Resource
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