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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 77 (1995), S. 6686-6694 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: This paper studies the effects of gate voltage on heat generation and transport in a metal–semiconductor field effect transistor made of gallium arsenide (GaAs) with a gate length of 0.2 μm. Based on the interactions between electrons, optical phonons, and acoustic phonons in GaAs, a self-consistent model consisting of hydrodynamic equations for electrons and phonons is developed. Concurrent study of the electrical and thermal behavior of the device shows that under a source-to-drain bias at 3 V and zero gate bias, the maximum electron temperature rise in this device is higher than 1000 K whereas the lattice temperature rise is of the order of 10 K, thereby exhibiting nonequilibrium characteristics. As the gate voltage is decreased from 0 to −2 V the maximum electron temperature increases due to generation of higher electric fields whereas the maximum lattice temperature reduces due to lower power dissipation. The nonequilibrium hot-electron effect can reduce the drain current by 15% and must be included in the analysis. More importantly, it is found that the electron temperature rise is nearly independent of the thermal package conductance whereas the lattice temperature rise depends strongly on it. In addition, an increase of lattice temperature by 100 K can reduce the drain current by 25%. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 2
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 68 (1996), S. 197-199 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A reduction of the adhesion between polysilicon surface-micromachined structures and its silicon substrate using ultrashort pulse laser irradiation has been demonstrated. Polysilicon cantilevers, which adhered to the silicon substrate after final rinse and dry, were freed after irradiation by a 800 nm wavelength laser with pulse duration of 150 fs (full width at half-maximum) and fluences up to 40 mJ/cm2. Increasing the pulse widths to 2.7 ps resulted in significantly fewer freed cantilevers indicating that the process depends heavily on the presence of high-temperature carriers in the silicon. Adhesion reduction has been observed from exposure to a single pulse which results in minimal lattice temperature increase. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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