ISSN:
1013-9826
Quelle:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Thema:
Maschinenbau
Notizen:
Molecular dynamics simulations are performed to verify the effect of grain boundary onnanolithography process. The model with about two hundred thousand copper (Cu) atoms iscomposed of two different crystal orientations of which contact surfaces are (101) and (001) planes.The grain boundary is located on the center of model and has 45 degree[removed info]angle in xz-plane. The tool ismade of diamond-like-carbon with the shape of Berkovich indenter. As the tool is indented andplowed on the surface, dislocations are generated. Moreover, during the plowing process, the steps aswell as the typical pile-ups are formed in front of the tool. These defects propagate into the surface ofthe substrate. As the tool approaches to the grain boundary, the defects are seen to be accumulatednear the grain boundary. The shape of the grain boundary is also significantly deformed after the toolpasses it. We observed the forces exerted on the tool by the contact with substrate, so that the frictioncoefficients can be obtained to address the effect of the grain boundary on the friction characteristics
Materialart:
Digitale Medien
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/54/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.340-341.961.pdf
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