Library

X
feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
  • 1
    Electronic Resource
    Electronic Resource
    Multiphoton laser-induced chemistry of organic esters: comparison with master equation calculated results (1982)
    s.l. : American Chemical Society
    Journal of the American Chemical Society 104 (1982), S. 5440-5452 
    Details
    ISSN: 1520-5126
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1021/ja00384a033
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 2
    Electronic Resource
    Electronic Resource
    Effect of Ball-Milling Method on the Formation of ODS Fe-14Cr-2Al-1Si-0.3Ta-1Y〈sub〉2〈/sub〉O〈sub〉3〈/sub〉 Powders (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 135 (Feb. 2008), p. 65-68 
    Details
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: Mechanical alloying (MA) process has been examined to synthesize ferritic stainlesssteel powder dispersed with nano-sized Y2O3 particles. A pilot-scale horizontal mill was fabricatedand compared with laboratory-scale ball mills and an attrition mill. Horizontal milling resulted in amuch better distribution of particle size and dispersoids than other milling methods. Althoughhorizontal milling is considered as a low-energy process requiring long times, processing time couldbe markedly reduced with increasing the diameter of horizontal mill with a proper control of millingparameters
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/24/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.135.65.pdf
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 3
    Electronic Resource
    Electronic Resource
    mei-41 is required for precocious anaphase in Drosophila females (2000)
    Springer
    Chromosoma 109 (2000), S. 44-49 
    Details
    ISSN: 1432-0886
    Source: Springer Online Journal Archives 1860-2000
    Topics: Biology , Medicine
    Notes: Abstract. This paper reports on a new role for mei-41 in cell cycle control during meiosis. This function is revealed by the requirement of mei-41 for the precocious anaphase observed in crossover-defective mutants. Normally in Drosophila oocytes, tension on the meiotic spindle causes a metaphase I arrest. This tension results because crossovers, and the resulting chiasmata, hold homologs together that are being pulled by kinetochore microtobules toward opposite spindle poles. In the absence of tension, such as in a recombination-defective mutant, metaphase arrest is not observed and meiosis proceeds through the two divisions. Here we show that in some recombination-defective mutants, the precocious anaphase requires the mei-41 gene product. For example, metaphase arrest is not observed in mei-218 mutants because of the severe reduction in crossing over. In mei-41 mei-218 double mutants, however, metaphase arrest was restored. The effect of mei-41 is dependent on double-strand break formation. Thus, in mutants that fail to initiate meiotic recombination the absence of mei-41 has no effect.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s004120050411
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 4
    Electronic Resource
    Electronic Resource
    Multiple Intraparenchymal Schwannomas in the Cerebellum, Brainstem, and Cervical Spinal Cord (1999)
    Springer
    Acta neurochirurgica 141 (1999), S. 779-780 
    Details
    ISSN: 0942-0940
    Source: Springer Online Journal Archives 1860-2000
    Topics: Medicine
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s007010050375
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 5
    Electronic Resource
    Electronic Resource
    Mycosis fungoides presenting as Ofuji's papuloerythroderma (2002)
    Oxford, UK : Blackwell Science Ltd
    Journal of the European Academy of Dermatology and Venereology 16 (2002), S. 0 
    Details
    ISSN: 1468-3083
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Medicine
    Notes: We report three patients presented with clinical features of Ofuji's papuloerythroderma (pruritic erythematous papules and extensive erythema sparing all skin folds), however, showing histopathological findings of mycosis fungoides (Pautrier's microabscess, haloed lymphocytes, disproportionate epidermotropism, and wiry collagen bundles). One case was associated with plaque stage of mycosis fungoides and follicular mucinosis. T-cell receptor (TCR) gene rearrangement analysis in the lesional skin tissue demonstrated rearrangement of the gamma chain in all cases. HTLV-1 serology was negative for two patients who conducted HTLV-1 test. We think that Ofuji's papuloerythroderma might be a variant of early mycosis fungoides rather than secondary skin manifestations to certain cutaneous inflammatory diseases.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1046/j.1468-3083.2002.00486.x
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 6
    Electronic Resource
    Electronic Resource
    Mycosis fungoides mimicking inflammatory linear verrucous epidermal nevus (2004)
    Oxford, UK : Blackwell Publishing Ltd.
    Journal of the European Academy of Dermatology and Venereology 18 (2004), S. 0 
    Details
    ISSN: 1468-3083
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Medicine
    Notes: We experienced an unusual case of mycosis fungoides with the clinical and histological features mimicking inflammatory linear verrucous epidermal nevus (ILVEN) in an 11-year-old boy. Localized linear multiple pruritic verrucous confluent papules and plaques appeared on the his left elbow, forearm and hand for 7 months. Skin biopsies showed characteristic findings of mycosis fungoides (e.g. Pautrier's microabscesses, follicular epitheliotropism, wiry bundles of collagen, etc.). T-cell receptor gene rearrangement analysis in the lesional skin demonstrated rearrangement of the gamma chain. RePUVA (systemic PUVA with retinoic acid) therapy improved his skin lesions and pruritus, but these progressed after discontinuation of treatment. Thus, lesions mimicking ILVEN can be an unusual and potentially misleading presentation of mycosis fungoides.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1111/j.1468-3083.2004.00891.x
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 7
    Electronic Resource
    Electronic Resource
    Collisional effects in infrared multiple-photon-induced unimolecular reactions of fluoroethane and trifluoroethane (1979)
    s.l. : American Chemical Society
    The @journal of physical chemistry 〈Washington, DC〉 83 (1979), S. 2809-2815 
    Details
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Physics
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1021/j100485a001
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 8
    Electronic Resource
    Electronic Resource
    Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization (2000)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 6359-6363 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The morphology of interfacial reaction products between four lead-free solder alloys on electroless Ni–P was characterized. The four Pb-free solders were 99.3Sn0.7Cu, 95.5Sn3.8Ag0.7Cu, 96.5Sn3.5Ag, and 96Sn2Ag2Bi (in wt%) alloys. After reflow, the interfacial intermetallics in the first two solders that contain Cu (99.3Sn0.7Cu and 95.5Sn3.8Ag0.7Cu) had good adhesion with electroless Ni–P. However, the 96.5Sn3.5Ag and 96Sn2Ag2Bi alloys formed interfacial intermetallics with a needle shaped morphology that spalled off the surface of electroless Ni–P. This difference is attributed to the role of Cu in the solders (which modified the chemical potential of the interfacial intermetallics), the volume change that occurs during intermetallic formation, and the interfacial properties of the compound. In solid state aging experiments, the consumption of electroless Ni–P by intermetallic growth was not significant (approximately 1 μm) and all the intermetallics had good adhesion to the electroless Ni–P. The electroless Ni–P exhibited some damage at the outer edge of the bond pad due to stress imposed during solid state aging. Large Ag3Sn and Cu6Sn5 intermetallics were observed in the bulk of the solders (except for SnAgBi solder), and these intermetallics are discussed in terms of soldering reaction at the interface and phase equilibrium. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.1321787
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 9
    Electronic Resource
    Electronic Resource
    Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils (1999)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 6746-6751 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Ni-based under bump metallization (UBM) is of interest in low cost flip chip technology primarily due to a slower chemical reactions with high-Sn solders such as eutectic SnPb as compared to Cu-based UBM. We studied wetting behaviors and interfacial reactions of the eutectic 63Sn–37Pb on Ni foils and Ni/Ti thin films using transmission electron microscopy (TEM), scanning electron microscopy, and energy dispersion x-ray analysis. Wetting angle, morphology of solder surface, and the rate of consumption of Ni have been studies as a function of reflow time at the temperatures of 200, 220, and 240 °C. From the TEM analysis, we found that Ni forms a single layer of scallop-type Ni3Sn4 compound with the eutectic SnPb. During the isothermal annealing, we observed the spalling of Ni3Sn4 compound from the Ni/Ti thin films. The spalling phenomenon is similar to that of Cu6Sn5 from the Cu/Cr thin films, yet the rate is slower. The spalling of Ni–Sn compound eventually caused dewetting of the molten solder from the Ti surface. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.371751
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
  • 10
    Electronic Resource
    Electronic Resource
    Kinetic analysis of interfacial diffusion accompanied by intermetallic compound formation (1999)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 1266-1272 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In interfacial reactions, a short-circuit diffusion along grain boundaries or interfaces can be accompanied by intermetallic compound formation. The compound penetrates the grain boundaries or the interfaces. This is a generic reliability issue for layered thin film structures because it causes a decrease in adhesion strength of the thin films. We have modified Fisher's grain boundary diffusion model to include this reactive kinetic process, and an analytical solution was obtained. A t1/4 dependence of penetration is found, the same as Fisher's model. The important kinetic parameters in the solutions are a diffusion coefficient along the short-circuit path, an intrinsic interdiffusion coefficient in the compound, and a partition coefficient. A comparison between the calculated and measured data from the lateral penetration of eutectic SnPb solder along the interface between electroless Ni and oxysilicon nitride dielectric, accompanied by Ni3Sn4 compound formation, is given. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.370880
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...