ISSN:
1432-1858
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
,
Technology
Notes:
Abstract Copper is widely used as a plating base for soft magnetic alloy electrodeposition in sensors and actuators. PMMA, the X-ray resist used in the LIGA process, typically has poor adhesion with copper. The use of black oxide of copper to enhance PMMA-copper adhesion was investigated. In this work, peel strength as a function of treatment time and the method of bonding was evaluated using an ASTM standard T-peel test. Peel strength increased with increasing treatment time. The feasibility of producing microstructures with predictable 3-D geometry for use in resonating sensors was investigated using the process developed. Nickel-iron structures of 100-1000 micrometers wide and 500 micrometers tall were successfully electrodeposited. Growth of other representative microstructures is being investigated.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/s005420050100
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