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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 90 (2001), S. 3578-3584 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Fluorine segregation influences the intrinsic reliability of thin gate oxides in poly-Si/SiO2/Si structures. We analyze diffusion and segregation kinetics of F in gate stacks with 5 nm gate oxides using secondary ion mass spectroscopy. Well defined doses of F were introduced by ion implantation. We find that F segregation at interfaces to the gate oxide is diffusion limited with an effective activation energy of 1.4 eV. For F concentrations lower than 5×1015 cm−2, F segregation is beneficial improving, for example, the tails of the Weibull plots and slightly increasing the breakdown field. For F doses higher than 1×1016 cm−2, detrimental consequences were found, degrading the charge to breakdown values by about a factor of 5 after long-term thermal treatments. From ab initio density functional theory pseudopotential calculations for atomic structures and total energies of segregated F, we conclude that the segregation to the interface is driven mainly by the energy difference between Si–O and Si–Si bonds in the interfacial region, by oxygen assisted strain relaxation around Si atoms attacked by F and, possibly, by kinetic bottlenecks in diffusion of network oxygen through SiO2. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 5008-5012 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The influence of a heavy Sb ion implantation and subsequent annealing cycles in the temperature range of 800–1000 °C on B-delta doping superlattices in silicon layers grown by molecular beam epitaxy (MBE) was analyzed. Secondary ion mass spectroscopy (SIMS) measurements of these structures are used to investigate the generation and diffusion of point defects. The enhanced diffusion of B from the delta doping spikes in as grown and Sb implanted layers was theoretically described by solving the diffusion equation using the point defect model of TSUPREM−4 for different initial point defect distributions. To fit the experimental SIMS profiles the positively charged B-interstitial diffusion coefficient was changed from the default value of D=0.68 cm2/s to D=0.45 cm2/s. It was found that the given MBE growth process produces interstitials and vacancies with an almost constant average value of about 5×1016 cm−3. The Sb-implanted B modulation doped superlattice allows us to obtain a depth profile of the defect concentration. Assuming an overlapping of a constant value of 5×1016 cm−3 for interstitials and vacancies caused by the MBE growth with a distribution coming out of a damage calculation during Sb implantation, consisting of a flat high concentration region with an exponential decrease towards the level of the MBE layer, the main features of the B diffusion profile in the superlattice could be fitted. Thus, a simple initial point defect distribution model after implantation was able to explain the experimental situation. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 7869-7874 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Boron spikes within multilayer structures of Si and of Si1−xGex deposited by means of molecular-beam epitaxy (MBE) at different temperatures have been investigated by secondary-ion-mass spectrometry (SIMS), spreading resistance, and Hall-effect measurements. For a Ge amount of x=7% it is shown that segregation effects, electrical activity of B, steepness of B spikes, and solid solubility of B differ in Si and Si1−xGex at the same deposition temperatures. For Si1−xGex growth the surface segregation is significantly reduced in comparison to the growth of Si layers. Steeper B profiles can be obtained at same temperatures but the amount of electrically inactive B is higher. Calculations of the charge-carrier distributions near the spikes have been performed using classical and quantum mechanical approaches to find out reasons for deviations of the concentration profiles of B and of holes obtained from SIMS and from spreading resistance measurements, respectively.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 76 (1994), S. 2191-2196 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A method is presented to simultaneously investigate in situ the relaxation and diffusion behavior of Si1−xGex layers on silicon substrates using a conventional x-ray powder diffractometer with a high-temperature attachment. The method allows the direct determination of the time and temperature dependence of the relaxation and of the maximum Ge content. The diffusivity of Ge in silicon was studied by x-ray diffraction and secondary ion mass spectroscopy measurements. A nonlinear dependence of the effective diffusion coefficient on the Ge content was deduced by solving a diffusion equation.
    Type of Medium: Electronic Resource
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  • 5
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The incorporation of oxygen into thin epitaxial Si and heteroepitaxial Si1−xGex layers deposited, applying a conventional atmospheric pressure process, from silane, germane, hydrogen chloride, and hydrogen gas mixtures in a temperature range from 1070 to 720 °C is analyzed. The role of oxygen for defect formation has been shown by means of a correlation between high resolution defect analysis using transmission electron microscopy and quantitative oxygen depth profiling using Auger electron spectroscopy and secondary ion mass spectrometry. In the low-temperature region traces of residual H2O vapor lead to oxygen precipitation. These precipitates are the origin of extended lattice defects such as stacking faults and microtwins and can result in highly defective films with polycrystalline inclusions and increased surface roughness. It was found that, in order to prevent the observed defects, it is necessary to keep the oxygen concentration below 3×1019 cm−3. However, by carefully controlling the experimental parameters it is also possible to realize nearly defect-free structures with high oxygen concentrations up to 1020 cm−3.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 74 (1999), S. 3377-3379 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Transient enhanced diffusion of B is strongly suppressed in C-rich Si. We show that the physical mechanism for this suppression is out-diffusion of C from regions of high C concentration. B doping superlattices with background C concentrations between 1018 and 1020 cm−3 were grown by molecular beam epitaxy and implanted with BF2 ions. The measured dependence of transient B diffusion on the C profile is explained by coupled diffusion for C and Si point defects. The proposed model is supported by the observation of transient enhanced diffusion of C. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 67 (1995), S. 1143-1144 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Strain compensation in SiGe by heavy boron doping was demonstrated. For this purpose, SiGe layers containing up to several percent of boron were deposited using rapid thermal chemical vapor deposition. The strain compensation effect was evaluated by double crystal x-ray diffraction measuring the difference between the diffraction peak distances of the boron doped samples and a reference sample without boron which can be directly related to the decrease of the lattice constant in Si1−x−yGexBy due to the incorporation of boron. The films were characterized by cross-sectional transmission electron microscopy (XTEM), Auger electron spectroscopy (AES), and secondary ion mass spectroscopy (SIMS). © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 66 (1995), S. 3197-3199 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Doping with phosphorus in solid source silicon molecular beam epitaxy is possible using a GaP decomposition source. This source evaporates solid GaP and is combined with an efficient mass separator system. Homogeneous P doping up to concentrations higher than 1019 cm−3 was realized. Surface accumulation of phosphorus was not observed for the low growth temperature of 400 °C used in this study. The parasitic Ga incorporation is about three orders of magnitudes below the P concentration. This new phosphorus doping technique is suitable for n-type doping in the range of 1017–1020 cm−3. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 64 (1994), S. 360-362 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: 10-nm-thick germanium layers have been grown on Si(100) with boron as a surfactant with three different growth procedures, and investigated with reflection high-energy electron diffraction, transmission electron microscopy, and secondary ion mass spectroscopy. We obtained smooth and completely closed epitaxial germanium layers only by depositing the boron on top of the amorphous germanium layer followed by a post-annealing step. The surface energy anisotropy of the germanium will be affected by the presence of boron in this equilibrium process. The islanding observed in all other growth processes can be understood by taking into account that boron is a typical nonsegregating material in Ge below 600 °C and a surfactant acts mainly due to its presence in the growing front.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 62 (1993), S. 294-296 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The N2O-rapid thermal processing (RTP) of (100) silicon and of SiO2 at 1150 °C for 30, 100, and 300 s leads to a constant nitrogen maximum content in an interlayer between SiO2 and Si with the consequence of decreasing nitrogen content at surface and in bulk with process time. If 10–10 000 vpm H2 is added to N2O during RTP the nitrogen incorporation remains generally unchanged. The nitrogen should be incorporated from the NOx species dissociated at the interface with favoring the Si–O binding. The nitrogen compensates defective sites near the interface and in the bulk also in the presence of hydrogen.
    Type of Medium: Electronic Resource
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