ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The growth behaviour of the intermetallic compounds (IMCs) in Pb-free solderbump is investigated. The Pb-free micro-bump, Sn-50%Bi, was fabricated by binary electroplatingfor flip-chip bond. The diameter of the bump is about 506m and the height is about 60 6m. In orderto increase the reliability of the bonding, it is necessary to protect the growth of the IMCs ininterface between Cu pad and the solder bump. For control of IMCs growth, SiC particles weredistributed in the micro-solder bump during electroplating. The thickness of the IMCs in theinterface was estimated by FE-SEM, EDS, XRF and TEM. From the results, The IMCs were foundas Cu6Sn5 and Cu3Sn. The thickness of the IMCs decreases with increase the amount of SiCparticles until 4 g/cm2. The one candidate of the reasons is that the SiC particles could decrease thearea which be reacted between the solder and Cu layer. And another candidate is that the particlecan make to difficult inter-diffusion within the interface
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.47-50.907.pdf
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