ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Primary heat dissipation method of IC Chip is still air-cooling at present. This paperpresents a new machining method of air-cooled plate fin heat sinks, namely orthogonal planing. Thesurface of plate fins machined by this method are rough enough to augment its specific surface area;the rough surface can also disturb laminar sub-layer of turbulent thermal boundary layer, thus thethermal resistances of thermal boundary layer are reduced. Therefore, heat dissipation efficiency ofheat sink can be enhanced further. The focus of plate fin heat sinks forming by orthogonal planing ishow to machine flat chips. A new pattern of chip curl that is called down-curl can be observed whenrake angle of tool is rather large and cutting thickness is very thin. As cutting thickness increases,down-curl chips become flat and then up-curling. There is a transition area that chips are not curledbetween down- and up-curl. The conditions that chips are not curled are obtained throughinvestigating influences of rake angle and cutting thickness on chip curl, and flat plate fins with roughsurface are produced
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.237.pdf
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