ISSN:
0305-6120
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
The mechanical and vibration responses of 225-pin, 324-pin and 396-pin PBGA(plastic ball grid array) solder joints have been determined in this study. The effects ofoverload environmental stress factors on the mechanical responses of the solder joints have beendetermined by bending and twisting experiments. The effects of shipping and functional environmentalstress factors on the vibration responses of the solder joints have been determined byout-of-plane vibration experiments and a mathematical analysis.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/03056129610799912
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