ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
This paper presents data obtained from a newly-developed instrument to test the qualityof solder interconnections at high strain rate – the ‘micro-impactor’. This shear test of theinterconnection at high strain rate mimics the stress experienced by the solder joint whenundergoing shock due to drop-impact. Instrumented with a load cell and linear variabledisplacement transducer (LVDT), it also has the ability to provide dynamic impact force anddisplacement data. Earlier concepts to characterise the solder joint at high strain rates such as theminiature pendulum impact tester [1] lacked this capability. This micro-impactor was used to studythe effect of increasing silver (Ag) and copper (Cu) concentration in solder alloys on the shearstrength of the solder joint. The performance of these lead-free alloys was also compared to that ofthe well-established leaded solder. It was found that increasing the silver content increases the yieldstrength of the solder, causing the failure to occur at the brittle intermetallic layer instead of in thebulk of the solder
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.32.99.pdf
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