Electronic Resource
s.l. ; Stafa-Zurich, Switzerland
Solid state phenomena
Vol. 121-123 (Mar. 2007), p. 1229-1232
ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
The purpose of this study is to reveal the mechanism of wafer touch polishing by high puritycolloidal silica slurry containing organic surfactants such as HEC (hydroxyl-ethyl cellulose). Theeffect of surfactant concentration on wafer touch polishing was studied with the aim of improvingroughness on wafer surface after polishing. As a result, the level of haze and micro-roughness aredecreased with the decrease of surfactant concentration
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.121-123.1229.pdf
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