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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    International journal of fracture 15 (1979), S. R37 
    ISSN: 1573-2673
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 18 (1983), S. 2274-2282 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract A tapered double cantilever beam specimen was modified in order to evaluate the fracture toughness of scarf joints. The modification was relatively simple: the bond line which is normally perpendicular to the applied load with this type of specimen was inclined to form the scarf joint. With this change, both normal and shear components of force act on the crack plane. Hence, in addition to measuring the total strain energy release rate, G total, its two components, the opening mode toughness, G I, and the edge shearing or tearing toughness, G III, were measured as well. In spite of the fact that the separation loads increased continuously with increasing scarf angle, or over-lap length, G totaland G III only increased so long as the ratio of over-lap length to thickness did not exceed 1.75∶1. Further increases in over-lap length decrease the toughness because of separation of fibres within the composite adherends.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 10 (1966), S. 1351-1371 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The fracture toughness of epoxy used in the bulk and adhesive form was measured by a previously developed technique. The uniform double cantilever-beam specimen, which was described earlier, was modified to a tapered beam, which simplified the experimental procedure and calculations for obtaining toughness measurements. by varying the ratio of hardener to resin and post-cure temperature on a single epoxy system (DER 332-TEPA), it was found that the toughness of the epoxy used in either bulk or bond form varied by a factor of approximately five. A particular combination of composition and post-curing temperature generally yielded higher toughness in the bulk than in the bond form. This was not always the case, however. At high post-cure temperatures, where the bonds were very tough, their toughness exceeded that of the bulk material. Hence, it does not appear possible to predict joint toughness from bulk toughness measurements. The toughness of joints was found to be a single-valued function of tensile modulus. For the bulk material, on the other hand, the toughness obtained on the epoxy having a specific modulus depended on the combination of composition and post-cure temperature. Joint toughness for any combination of composition and post-cure temperature depended only on the cracking rate. If the epoxy was the type that caused cracks to jump rapidly, the epoxy was tough and vice versa. For a particular epoxy system, toughness was increased by driving the crack at an increasing rate.
    Additional Material: 15 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 15 (1971), S. 641-659 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The toughness and stress corrosion cracking characteristics of an epoxy resin (DER 332) hardened with hexahydrophthalic anhydride (HHPA) were investigated. The epoxy was studied in both the bulk and bond form, and its properties were compared with an amine-hardened (tetraethylene pentamine, TEPA) system. The toughness, GIc, of the anhydride system varied less as a function of ratio of hardener-to-resin content and postcure temperature than it did in the TEPA-hardened system. Like the latter, however, its toughness in the bulk and bond forms could not be correlated, but GIc of the joints was dependent on tensile modulus and/or yield strength of the bulk epoxy. Both systems were also toughened in the vicinity of the crack tip by water for short-time loading, but their long-time load carrying capability was reduced by a water environment. The anhydride hardened system was more sensitive to strength loss in water than the amine system. The fracture morphology for the two systems was the same, i.e., fast cracking occurred cohesively near the center of the bond, and slow cracking occurred at the interface.
    Additional Material: 17 Ill.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 13 (1969), S. 1083-1111 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Environment assisted fracturing, or stress corrosion cracking of adhesive joints in liquid water or a humid atmosphere was shown to occur at values of applied crack extension force ςa considerably below those required for onset of opening-mode rapid fracture ςc. The minimum value of ςa below which no cracking was observed, ςSSC, was dependent on the relative humidity and the particular adhesive used. For two adhesive systems, the one with the lower hardener content and post cure temperature showed both a lower absolute value of ςSSC and a lower ratio of ςSSC to ςc. The value of ςSSC for both adhesive systems decreased as the humidity was increased. As the relative humidity approached 100%, the value of ςSSC approached its value for liquid water. Values of ςc for the two adhesives differed by a ratio of approximately 2:1. When water was introduced to the crack tip, ςc for the less tough material increased while it was not significantly changed for the tougher material.
    Additional Material: 22 Ill.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 15 (1971), S. 661-673 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Increasing joint thickness was shown to increase the toughness of epoxy joints hardened with either tetraethylenepentamine (TEPA) or hexahydrophthalic anhydride (HHPA). The increased toughness was associated with a marked increase in macroroughness. An upper limit of joint thickness and hence toughness occurred because very thick joints could not be produced. Residual stresses developed during cooling from the curing temperature caused the latter to separate at the interface. Stress corrosion cracking resistance was also found to depend on bond thickness. For the TEPA-hardened system, bond thickness had only a minor influence for thicknesses up to 25 mils; and for the HHPA-hardened system, this persisted to bond thickness of 50 mils. Further increases in bond thickness for both systems caused an abrupt rise in resistance to stress corrosion cracking.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
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