Electronic Resource
[S.l.]
:
American Institute of Physics (AIP)
Journal of Applied Physics
84 (1998), S. 4248-4254
ISSN:
1089-7550
Source:
AIP Digital Archive
Topics:
Physics
Notes:
The early stage of electromigration in thin gold films on polyimide has been investigated at room temperature using the resistometric technique. While the resistance increase is initially linear, a saturation tendency is observed for longer stressing times at all stress current densities. A simple model is described which relates the saturation behavior in the resistance change to the buildup of mechanical stress gradients, which produce a counterflux of metal ions proportional to the stress gradient. The stress gradients arise due to nonuniformity in the grain size in the polycrystalline thin metal films which produces cluster regions of small grain size alternating with regions of large or near-bamboo grain size, which have larger and smaller metal ion diffusivities, respectively. The dependence of the maximum level of the resistance's change and the rate of resistance increase on the stress current density are experimentally characterized and compared with the model's predictions with good agreement. © 1998 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.368641
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