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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 146-153 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Kinetics of dissolution of alumina substrates in seven compositions of high lead glasses have been studied. The dissolution process is controlled by correlated diffusion of Al and Pb (and/or B), with interdiffusion coefficients D, at 850 °C, 10 min, in the range from 10−10 to 10−6 cm2 s−1, according to the different compositions. Al solubility ranges from about 10% to 20%. The diffusivity and solubility increase by increasing the content of B and Pb. The reactivity of alumina substrates with the glassy component of thick-film resistors greatly affects their microstructure and electrical properties. Some consequences of these interactions have been evidenced: change in electrical resistivity and its dependence on the resistor thickness, changes in the sintering process and grain growth of RuO2 grains, and a catalytic effect on phase transformations of pyrochlore ruthenates in rutile RuO2 in the glassy matrix of resistors. Moreover, it is shown that Al dissolution gives rise to a recession of the buried glass/substrate interface, which can easily be measured. When alumina is concerned, this measurement gives insight of the sum of two processes: aluminum dissolution in the glass layer and grain-boundary diffusion of glass into the substrate itself.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Sensors and Actuators 19 (1989), S. 401-414 
    ISSN: 0250-6874
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Electrical Engineering, Measurement and Control Technology
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 2 (1991), S. 46-53 
    ISSN: 1573-482X
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract A model system of thick-film resistor (TFR) was prepared starting from RuO2 powders and a lead-free glass. The microstructural development was investigated by scanning and transmission electron microscopies, energy dispersive X-ray fluorescence, X-ray diffraction, thermogravimetry and other complementary techniques. The electrical properties of the resistors were analysed with particular attention to sheet resistance, temperature coefficient of resistance, size effects and piezoresistive properties. It was found that these simple systems are interesting with respect to their stability in ageing tests at relatively high temperatures but they are not promising for high-temperature piezoresistive gauges because of low strain sensitivity. Some samples were also prepared with a Bi2Ru2O7; a notable exchange reaction occurs between the conductive grains and the glass matrix which prevents the formation of pyrochlore-type based resistors with this glassy matrix.
    Type of Medium: Electronic Resource
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