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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 329 (Jan. 2007), p. 451-458 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Based on the single abrasive particle motion locus of elliptical spiral in two-dimensionalultrasonic vibration grinding (WTDUVG), the theoretical model representing the material removalrate are deduced and verified, and the reason of high efficiency material removal by applyingtwo-dimensional ultrasonic vibration is analyzed. Finally, experimental researches on materialremoval rate of ceramics were carried out using coarse grit diamond wheel both with and withoutworkpiece two-dimensional ultrasonic vibration assistance grinding. Experimental results indicatedthat (1) Material removal rate (MRR) in vibration grinding process is about 1.5 times as large asthat of in conventional grinding, the experimental results are in good agreement with the calculatedones. (2)The material removal rate increases along with increases of the grinding depth andworkpiece velocity both in with and without vibration grinding. (3)The vibration grinding surfacehad no spur and build-up edge and its surface roughness was smaller than CG significantly. Surfacequality of WTDUVG is superior to that of conventional grinding, it is easy for ultrasonic vibrationgrinding that material removal mechanism is ductile regime grinding
    Type of Medium: Electronic Resource
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