Digitale Medien
s.l. ; Stafa-Zurich, Switzerland
Solid state phenomena
Vol. 127 (Sept. 2007), p. 271-276
ISSN:
1662-9779
Quelle:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Thema:
Physik
Notizen:
To make the tungsten and copper joint, several methods has been triedusing the diffusion bonding system. When the thin plating Ni layer was used as theinterlayer on tungsten surface, it bonded with copper under low bonding temperatureand short holding duration by the pulse electric current sintering (PECS) machine.The effects of bonding temperature, bonding duration time, bonding pressure and thedifference of specimen shape on the bonding strength were investigated. The tensilestrength of joints depended on these factors. Highest strength attained to the coppertensile strength
Materialart:
Digitale Medien
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/24/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.127.271.pdf
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