ISSN:
1433-0768
Keywords:
Key words Via failures
;
Silicon nodules
;
Aluminum interconnects
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
Notes:
Abstract We have evaluated the electrical characteristics of silicon-nodule-related via failures in the aluminum interconnects of silicon integrated circuits. Current-voltage measurements indicated that the conduction mechanism follows Ohm's law. The resistance was 1.5–3 kΩ for a silicon nodule at a via of 1.0 μm × 1.0 μm. When the applied voltage was 3–6 V, the resistance decreased abruptly. This transition (abrupt decrease in resistance) was irreversible. We think that the resistance of 1.5–3 kΩ and the transition voltage of 3–6 V are two factors characterizing the silicon nodule. We can explain these values by assuming that aluminum in the silicon nodules at a solubility limit concentration acts as an acceptor.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/s100080050009
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