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  • 2005-2009  (1)
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    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 127 (Sept. 2007), p. 251-256 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: Titanium boron nitride (Ti,B)N films have been prepared by depositing Ti and B atomvapor on a (100) Si single crystal and an amorphous glass substrates under simultaneous irradiationof N ions, that is ion mixing and vapor deposition (IVD) technique. The transport ratio of metalsand ion, (Bva+Tiva)/Nion, was fixed at 4, and the film thickness was supposed to be 1 [removed info]m. With anincrease in the evaporation ratio of B and Ti, Bva/Tiva, from 0 to 3, microstructure of the film waschanged from fine triangular to granular morphology. It was confirmed by the XPS analysis that Nions were preferentially coordinated with Ti atoms when the Bva/Tiva was relatively low otherwisenitriding of B probably occurred. This result was also supported by the XRD spectra of the films.Knoop hardness of the (Ti,B)N films was strongly dependent on the Bva/Tiva. The highest hardnessof approximately 5000 was observed at the Bva/Tiva=0.3; this implies that a small amount of alloyingB considerably increases the film hardness
    Type of Medium: Electronic Resource
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