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  • 1995-1999  (2)
  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 3642-3645 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Electroplated copper exhibits some surprising changes at room temperature in sheet resistance, stress, and microstructure. This behavior, now known as self-annealing, is shown here to be intimately linked to the composition of the plating bath and the resulting incorporation of organic additives in the Cu layer. Their addition is a necessary condition for self-annealing to occur, but slows down the process for higher concentrations. The phenomenon also depends critically on film thickness, showing an accelerated transformation when film thickness increases. This dependence is explained in terms of a very rapid primary crystallization from the top surface down just after deposition, followed by a slower lateral recrystallization producing large secondary grains. The stress and sheet resistance during recrystallization are identified as two noncorrelated variables. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In this paper we experimentally investigate the application of selective interdiffusion to p-type (Zn doped) distributed Bragg reflectors, as employed within a range of vertical cavity devices, as a means of lowering the series resistance. Various rapid thermal anneal temperatures and times are studied, both with and without silica encapsulants. The degree of intermixing, and hence series resistance reduction, is found to be cap dependent and this is verified both by secondary ion mass spectrometry and electrical resistance measurements. Both these techniques suggest that the intermixing, due primarily to Zn enhanced interdiffusion, is increased when no encapsulant is used. In this case a series resistance reduction approaching 50% is achieved within the 14 period GaAs/AlAs Bragg reflector. In the silica encapsulated case Ga vacancies are injected into the structure and these suppress the movement of Zn. The resulting Ga diffusion coefficient in this case is found to decrease by a factor of 3 relative to the uncapped case. The effects of interdiffusion on the reflection properties of the reflector, under various anneal conditions, are also described. This has previously been studied theoretically [Floyd et al., J. Appl. Phys. 75, 7666 (1994)] but here we offer experimental evidence on the optical effects of intermixing. We show that the peak reflectivity is found to decrease only slightly with temperature and time, again depending on capping conditions. The major effect contributing to the reflectivity decrease however is surface degradation due to As out-diffusion. The reflectivity does decrease appreciably (∼10%) when the interdiffusion length of the group III atoms becomes a significant fraction of the quarter-wave thickness of the GaAs/AlAs layers, as demonstrated in samples annealed at high temperatures and for long times (960 °C/360 s). These issues, along with that of planar integration of vertical cavity lasers and other devices such as modulators and detectors, are of importance for future applications. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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