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Digitale Medien

Depth profiling of copper thin films by resonant laser ablation (1995)

Allen, T. M. ; Kelly, P. B. ; Anderson, J. E. ; [weitere]

Springer

Applied physics 61 (1995), S. 221-225

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Details

ISSN: 1432-0630

Schlagwort(e): 78.65 ; 07.75 ; 81.60 ; 82.80

Quelle: Springer Online Journal Archives 1860-2000

Thema: Maschinenbau , Physik

Notizen: Abstract In Resonant Laser Ablation (RLA), material is related and selectively ionized by a low-energy pulse from a tunable laser. The selectivity and efficiency allow detection and quantitation at very low concentrations. We demonstrate that RLA has potential use in profiling thin layer and multilayer structures. Quantitative results are reported on the analysis of 20 and 100 Å copper thin films on Si(110) surfaces. Removal rates range from 10−3 to 10−2 Å/shot. Prospects for interrogation of dopants and impurities are also evaluated.

Materialart: Digitale Medien

URL: http://dx.doi.org/10.1007/BF01538394

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