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  • 1
    Electronic Resource
    Electronic Resource
    Dual-beam ablation of fused quartz using 266 nm and VUV lasers with different delay-times (1997)
    Springer
    Applied physics 64 (1997), S. 477-481 
    Details
    ISSN: 1432-0630
    Keywords: PACS: 42.60; 81.60
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s003390050504
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    Paper (German National Licenses)
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  • 2
    Electronic Resource
    Electronic Resource
    High-quality and high-efficiency machining of glass materials by laser-induced plasma-assisted ablation using conventional nanosecond UV, visible, and infrared lasers (1999)
    Springer
    Applied physics 69 (1999), S. S879 
    Details
    ISSN: 1432-0630
    Keywords: PACS: 42.60; 81.60
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract. This paper reports the micromachining of fused quartz and Pyrex glass by laser-induced plasma-assisted ablation (LIPAA) using a conventional nanosecond laser at wavelengths 266 nm, 532 nm, and 1064 nm, respectively. High-quality surface structuring can be achieved at each of these wavelengths. The micrograting formed has periods of 14 μm at 266 nm, 20 μm at 532 nm, and 30 μm at 1064 nm, respectively. The ablation rate using a 266 nm laser is much larger than that at longer wavelengths. The ablation thresholds of laser fluence are 0.7 J/cm2 for 266 nm, 1.5 J/cm2 for 532 nm and 3.7 J/cm2 for 1064 nm, respectively. The 532 nm and 1064 nm lasers enable hole drilling in 0.5 and 2.0-mm thick fused quartz and Pyrex glass substrates of about 0.7–0.8 mm in diameter. However, the less destructive through channel can be only formed in Pyrex glass by using a 532 nm laser.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s003390051551
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    Dual-beam ablation of fused silica by multiwavelength excitation process using KrF excimer and F2 lasers (2000)
    Springer
    Applied physics 71 (2000), S. 23-26 
    Details
    ISSN: 1432-0630
    Keywords: PACS: 42.60; 81.60
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract. A new technique of dual-beam laser ablation of fused silica by multiwavelength excitation process using a 248-nm KrF excimer laser (ablation beam) coupled with a 157-nm F2 laser (excitation beam) in dry nitrogen atmosphere is reported. The dual-beam laser ablation greatly reduced debris deposition and, thus, significantly improved the ablation quality compared with single-beam ablation of the KrF laser. High-quality ablation can be achieved at the delay times of KrF excimer laser irradiation shorter than 10 ns due to a large excited-state absorption. The ablation rate can reach up to 80 nm/pulse at the fluence of 4.0 J/cm2 for the 248-nm laser and 60 mJ/cm2 for the F2 laser. The ablation threshold and effective absorption coefficient of KrF excimer laser are estimated to be 1.4 J/cm2 and 1.2×105 cm-1, respectively.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s003390050020
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    Paper (German National Licenses)
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  • 4
    Electronic Resource
    Electronic Resource
    High-speed machining of glass materials by laser-induced plasma-assisted ablation using a 532-nm laser (1998)
    Springer
    Applied physics 67 (1998), S. 499-501 
    Details
    ISSN: 1432-0630
    Keywords: PACS: 42.60; 81.60
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: + :YAG laser (532 nm). The plasma generated from a silver (Ag) target by the laser irradiation effectively assists in ablation of the fused quartz substrate by the same laser beam, although the laser beam is transparent to the substrate. A grating with a cross-sectional shape like a square-wave (period ≈ 20 μm) is achieved using the mask projection technique. The ablation rate reaches several tens nm/pulse. In addition, LIPAA is applied to high-speed hole drilling (700 μm in diameter) of fused-quartz (0.5 mm thick) and Pyrex glass (0.5 mm thick).
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s003390050810
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    Paper (German National Licenses)
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  • 5
    Electronic Resource
    Electronic Resource
    Laser-induced plasma-assisted ablation of fused quartz using the fourth harmonic of a Nd+:YAG laser (1998)
    Springer
    Applied physics 67 (1998), S. 545-549 
    Details
    ISSN: 1432-0630
    Keywords: PACS: 42.60; 81.60
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: + :YAG laser (266 nm) is reported. With the assistance of plasma resulting from laser irradiation on a metal target, the fused-quartz substrate is easily etched by the 266-nm laser beam in spite of the fact that the substrate is transparent to this wavelength. In contrast, no ablation takes place without the metal target, but damage is generated on the substrate surface. The ablated region is observed by optical microscopy and scanning probe microscopy (SPM), which reveal a fine grating structure (line spacing of 20 μm) without any severe damage. A series of experiments on the dependence of the ablation rate and the threshold laser fluence on ablation parameters, such as laser fluence, the number of pulses, and the distance between the fused quartz and the metal target is performed. On the basis of the results, three possible mechanisms of direct plasma interaction, plasma heating, and metal film deposition are discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s003390050819
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    Paper (German National Licenses)
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