ISSN:
0021-8995
Keywords:
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
The effect of the filler silica particle size on the properties of integrated circuits (IC) packages sealed with an epoxy molding compound was studied. For this purpose, two kinds of epoxy molding compounds filled with irregular-shaped silica particles having mean sizes of (A) 16 μm and (B) 5 μm were prepared. The fracture toughness (Kc) of cured A was higher than that of cured B, but the flexural strength of cured A was lower than that of cured B, i.e., cured A and B had opposite physical properties. The thermal shock test was carried out in which IC packages were repeatedly dipped alternately in -65 and 150°C liquids and package cracking was observed. The thermal shock property of the IC package sealed with A was superior to that sealed with B. There was a good relationship between the thermal shock test property and Kc value. © 1993 John Wiley & Sons, Inc.
Additional Material:
4 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/app.1993.070490213
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