Electronic Resource
Woodbury, NY
:
American Institute of Physics (AIP)
Applied Physics Letters
56 (1990), S. 904-906
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
Very thin copper lines for seeding of chemical copper deposition have been deposited by laser direct writing techniques, using water soluble precursor films from copper formate. Writing speeds of up to 50 mm/s could be reached. The deposition process has a strong influence on the substrate surface, thereby achieving a very stable film adhesion.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.102624
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