ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The functional materials such as sapphire, silicon wafer etc. are processed efficientlywith ultra-smooth surface for the demand of the rapid development of the IC industry. The precisedouble sided polishing process is one of the main methods of getting the ultra-smooth surface forthese materials. This paper introduces the structure and characteristic of the precise double sidedpolishing machine with a precise pressure control system equipped a new type electro-pneumaticdigital servo valve. The works, such as machine design, development of the control system andoptimization of process parameters etc. are carried out to meet the requirement of the precise doublesided polishing machining process. This equipment has the characteristic of high machiningprecision and precise control capability, so it can be applied to the ultra-precise machining of theultra-thin sapphire, silicon wafers etc
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.315-316.375.pdf
