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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 317-318 (Aug. 2006), p. 317-322 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Methylsilsesquioxane films were formed on glass substrates by dropping a sol preparedfrom methyltriethoxysilane and then heat-treated in an oven. Nanoindentation test was performed toassess the elastoplastic properties of the films, including the relative residual depth ξr, Meyer hardnessHM, work-of-indentation WI and the elastic modulus E’. The values of ξr, HM and WI were obtained bya Berkovich indenter and E’ was determined by a spherical indenter on the basis of Hertz elastictheory. ξr decreased with the increase in the heat treatment time, whereas HM , WI and E’ significantlyincreased with the time. The changes in the mechanical properties with the heat treatment time wellreflected the evolution of the Si-O-Si network structure in methylsilsequioxane film
    Type of Medium: Electronic Resource
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