ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
To obtain the amorphous alloy films with superior properties by method ofelectrochemical deposition, the accuracy requirement for the copper substrates for Alloy Films isextraordinarily strict. The ultraprecision lapping technology for the copper substrate employingpolyurethane polishing pad and flannel pad is studied in this paper, surface roughness, materialremoval rate and change process of surface construction of copper substrates are discussed. Theinfluences of the different lapping parameters on the surface roughness, material removal rate andthe influences of lapping load on copper substrate surface formation in the ultraprecision lappingprocess of copper substrate are both discussed. Experiment results show that the surface scratch willdisappear by employing polyurethane polishing pad and flannel pad, and an extremely smoothsurface of copper substrate with roughness 6nm Ra is obtained in the final finishing lappingprocess
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.359-360.349.pdf
