ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
In-situ observation by scanning electron microscope of the microstructure evolution nearthe cathode depletion region and the quantitative analysis on the number of hillock phases in theeutectic SnPb edge drift structure made it clear that the dominant migrating element and dominanthillock phase were Sn and Pb, respectively, under 50 oC while both dominant migrating element anddominant hillock phase were Pb above 100 oC. Such temperature-dependence of the dominant hillockphases in the eutectic SnPb solder can be understood by considering the atomic size factors of themetallic solid solutions
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.124-126.9.pdf