Electronic Resource
s.l. ; Stafa-Zurich, Switzerland
Solid state phenomena
Vol. 124-126 (June 2007), p. 1145-1148
ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
The effect of a microwave-enhanced wet chemical etching process of SiC particles on theelectroless copper plating and on the Al/Cu-coated SiC composites was investigated. Themicrowave-enhanced wet etching process increased the concentration of surface oxides on SiC. TheBET surface area of SiC increased, reached its maximum value at 30 s, and then decreased during anetching process. The enhanced chemical adhesion strength between the coated copper and SiC wasobserved after an etching process. Furthermore, the sintering density and transverse rupture strength(TRS) of Al/Cu-coated SiC composites were improved when SiC particles were etched. This resultindicated that the microwave-enhanced etching of SiC particles also improved chemical andmechanical adhesion of Al/Cu-coated SiC composites
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.124-126.1145.pdf
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