ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
This paper presents a method for analyzing the cure of multilayer circuit boards containing chemically reactive adhesive interlayers. The cure kinetics of the adhesive are first quantified by differential scanning calorimetry, using the method of Freeman and Carroll to obtain the numerical kinetic parameters. These parameters are then used in a finite-element model of the circuit board which solves the heat and species transfer equations simultaneously. It is then possible to predict the temperature and extent of reaction at any time and position within the laminate, enabling the curing program to be optimized.
Additional Material:
6 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760280605
