ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract Glass matrix-fibre and glass infiltrated ceramic composites with interconnected phases have been shown to have the potential for displaying optimum thermal conductivity and dielectric constant at 1 MHz making them useful as substrates for electronic packaging. Ceramic (Nicalon and silicon carbide grade (SCS)) fibre-borosilicate glass composites were fabricated using tape casting processes combined with pressure and pressureless sintering techniques. Experiments were also conducted to process AIN ceramics with interconnected porous channels which were then hot infiltrated with borosilicate glass. Results of optical characterization of the composites indicate that infiltration of Nicalon cloth with glass is achieved by hot pressing, while the tape casting and lamination approach followed by sintering is useful for fabricating composites of glass and Nicalon tows. The sintered aluminium nitride ceramics are comprised of ≈28% (volume fraction) interconnected pores. Hot infiltration yielded ≈100 μm penetration of borosilicate glass into the pores of the nitride ceramic. The paper discusses the various scientific aspects involved in processing the glass-fibre and porous AIN composites containing 3-d interconnected pores. Results of the microstructural characterization of these composites are discussed particularly in regards to the desired microstructure essential for these composites to be useful as substrates in electronic packaging.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00354443
