ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
For measuring deformation of electronic packages, various techniques have been used.Each technique has some merits and demerits. Some techniques have very high resolution but smallmeasuring area. On the contrary, other techniques have large measuring area and low resolution. Sothe judicious selection of techniques with a trade-off between the resolution and availablemeasuring area is important. In this research, a new laser profiler was developed by integrating highresolution laser displacement sensor into the x-y scanner. This system has 10nm vertical resolutionand 100nm horizontal resolution with a measurement area up to 25mm by 25mm. The residualdeformation of a lead-contained and lead-free PBGA package after reflow process was measured bythe newly developed system. And the effect of aging was evaluated
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.326-328.513.pdf
