ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The microstructure evolution and the growth behavior of intermetallic compounds (IMCs)at Sn-xZn-2Cu/Cu (x=6.5, 8.8, 10 and 12, wt%) interfaces during soldering were investigated. Theresults indicate that planar Cu5Zn8 layer is formed at each interface of Sn-8.8Zn-2Cu/Cu, Sn-10Zn-2Cu/Cu and Sn-12Zn-2Cu/Cu couples for all soldering time. However, for Sn-6.5Zn-2Cu/Cu couple,it is Cu5Zn8 phase that formed at the interface within shorter soldering time (1 h and 4 h), but theinterfacial reaction products become a double layer structure of Cu6Sn5 phase (near Cu substrate) andCuZn phase (near solder) for longer soldering time (25 h and 49 h). The thickness of IMC layers in allcouples increases exponentially with the soldering time. It is also found that for the same solderingtime, the thickness of IMC layers increases with increasing Zn content in the solder
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.373-374.543.pdf
