ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
A preplated frame (PPF) consisting of Au/Pd/Cu-Sn/Cu substrate, i.e., preplated with aCu-Sn alloy instead of Ni commercially used, was fabricated by electroplating and then thefeasibility of the frame as an alternative PPF was investigated. The wettability of the Cu-Sn alloywas better than that of Ni, resulting in excellent contact with the substrate and smoother surface onthe upper Au/Pd protective layer. By XPS analyses, it was confirmed that Cu atoms in the Cu-Snalloy layer did not diffuse through the thin protective layer to the surface at temperatures used in ICassembly. The wire pull-strength and solderability of the Cu-Sn alloy PPF were almost equivalentto those of the Ni PPF. However, the former showed much better corrosion resistance than the latter
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.124-126.227.pdf