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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 140 (Oct. 2008), p. 185-190 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: Predicting the properties of a material from knowledge of the internal microstructures isattracting significant interest in the fields of materials design and engineering. The most commonlyused expression, known as Hall-Petch Relationship (HPR), reports on the relationship between theflow stress and the average grain size. However, there is much evidence that other statisticalinformation that the grain size distribution in materials may have significant impact on themechanical properties. These could even be more pronounced in the case of grains of thenanometer size, where the HPR is no longer valid and the Reverse-HPR is more applicable. Thispaper proposes a statistical model for the relationship between flow stress and grain sizedistribution. The model considered different deformation mechanisms and was used to predictmechanical properties of aluminium and copper. The results obtained with the model shows thatthe dispersion of grain size distribution plays an important role in the design of desirablemechanical properties. In particular, it was found that that the dependence of a material’smechanical properties on grain size dispersion also follows the HPR to Inverse-HPR type ofbehaviour. The results also show that copper is more sensitive to changes in grain size distributionthan aluminium
    Type of Medium: Electronic Resource
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