Digitale Medien
s.l. ; Stafa-Zurich, Switzerland
Advanced materials research
Vol. 32 (Feb. 2008), p. 93-98
ISSN:
1662-8985
Quelle:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Thema:
Maschinenbau
Notizen:
This paper presents bonding technology of aluminum alloy by hot-dipping tin. Thedissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn.Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidatecharacteristics of interfacial evolution, the microstructure of the coatings, soldered joint wereanalyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was testedas high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry
Materialart:
Digitale Medien
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.32.93.pdf
Bibliothek |
Standort |
Signatur |
Band/Heft/Jahr |
Verfügbarkeit |