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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 33-37 (Mar. 2008), p. 23-28 
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Dimple fracture tests are conducted under mode I and mixed mode lading conditions.Dimple fracture zone and shear-lip fracture zone are observed by scanning electron microscopeprecisely. It is found that crack growth direction is affected largely by the change of loadingcondition. It is also found that the differences of fracture pattern between mid-plane and at freesurface are very large. Void diameter and crack growth direction are measured. Numericalsimulation is conducted to simulate fracture tests in three-dimensional field. Gurson’s constitutiveequation is used and large deformation analyses are conducted. It is assumed that void nucleation iscontrolled by both plastic strain and stress. Numerical results are compared with those ofexperiments. It is found that results of numerical simulation agree well with those of experimentqualitatively
    Type of Medium: Electronic Resource
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