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RHEOLOGICAL MODEL OF SOY DOUGH IN EXTRUSION (1978)

CHEN, A. H. ; JAO, Y. C. ; LARKIN, J. W. ; [et al.]

Oxford, UK : Blackwell Publishing Ltd

Journal of food process engineering 2 (1978), S. 0

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ISSN: 1745-4530

Source: Blackwell Publishing Journal Backfiles 1879-2005

Topics: Process Engineering, Biotechnology, Nutrition Technology

Notes: A viscosity model of defatted soy dough under various conditions of shear rate, temperature and moisture level in the extrusion process is reported. The model represents the data well within the shear rate range of 50 to 1,000 s−1, the temperature range of 100 °C to 160 °C, and the added moisture range of 22% to 32%. The flow index is determined to be 0.127, and response surfaces of the viscosity are also presented.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1111/j.1745-4530.1978.tb00215.x

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