ISSN:
1432-0630
Keywords:
78.65
;
07.75
;
81.60
;
82.80
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Abstract In Resonant Laser Ablation (RLA), material is related and selectively ionized by a low-energy pulse from a tunable laser. The selectivity and efficiency allow detection and quantitation at very low concentrations. We demonstrate that RLA has potential use in profiling thin layer and multilayer structures. Quantitative results are reported on the analysis of 20 and 100 Å copper thin films on Si(110) surfaces. Removal rates range from 10−3 to 10−2 Å/shot. Prospects for interrogation of dopants and impurities are also evaluated.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01538394
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