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Electronic and atomic structure of metastable phases of boron nitride using core-level photoabsorption (1993)

Chaiken, A. ; Terminello, L. J. ; Wong, J. ; [et al.]

Woodbury, NY : American Institute of Physics (AIP)

Applied Physics Letters 63 (1993), S. 2112-2114

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ISSN: 1077-3118

Source: AIP Digital Archive

Topics: Physics

Notes: Soft x-ray core-level photoabsorption has been measured from three forms of boron nitride, namely the hexagonal (hBN), cubic (cBN), and incoherent (iBN) phases. The B 1s and N 1s photoabsorption spectra of the hBN sample show evidence of both σ*- and π*-empty states, indicative of sp2 bonding, while the cBN absorption spectra exhibits only sp3 bonding in absorption features characteristic of the zincblende structure. The incoherent phase of BN in the form of a thin film on a Si substrate possesses σ* and π* states similar to hBN. The B 1s π* absorption features of the iBN film show an angular dependence which suggests that the microstructure consists of hexagonal-phase layer planes oriented normal to the BN/Si interface.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1063/1.110556

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Three-dimensional finite element simulation of thermoforming (1990)

Nied, H. F. ; Taylor, C. A. ; Delorenzi, H. G.

Stamford, Conn. [u.a.] : Wiley-Blackwell

Polymer Engineering and Science 30 (1990), S. 1314-1322

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ISSN: 0032-3888

Keywords: Chemistry ; Chemical Engineering

Source: Wiley InterScience Backfile Collection 1832-2000

Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics

Notes: The development of a finite element program specifically designed to simulate thermoforming in complex three-dimensional geometries is described. The large strain finite element model developed for simulating thermoforming processes is based on a total Lagrangian formulation which results in a nonlinear system of equations that must be solved iteratively. The nonlinear material behavior and contact between the polymer and mold surf aces ieads to additional complications in the numerical solution of the thermoforming simulation problem. In an effort to verify the accuracy of the finite element model developed in this study, analyses are compared with measurements obtained from three-dimensional three-formed parts.

Additional Material: 8 Ill.